Research on Green Express Packaging Design under the Electronic Commerce
نویسندگان
چکیده
منابع مشابه
Design-Analysis (Thermal and Mechanical) Integration Research for Electronic Packaging
Simulating the characteristics of electronic packages like thermal resistance, thermomechanical stress distribution and electromagnetics is important to guide and verify their design. Since packages consist of densely packed components of varied materials and shapes, the simulation time for generating their finite element analysis (FEA) models can span from hours to days. This paper overviews e...
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ژورنال
عنوان ژورنال: Open Journal of Business and Management
سال: 2016
ISSN: 2329-3284,2329-3292
DOI: 10.4236/ojbm.2016.44063